PlayStation 5 Pro Reportedly Fixes PS5 Design Flaws

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  • PS5 uses a liquid metal interface between the heatsink and chip to increase thermal conductivity. But potential leaks in vertical consoles pose a significant reliability risk.

  • A new teardown of the PS5 Pro reveals that the console's heatsink design has been tweaked compared to the base PS5, likely to reduce liquid metal leaks.

  • The liquid metal issue has not affected PS5 owners broadly, but Sony is clearly committed to identifying and addressing potential risks to ensure long-term reliability.

The latest investigation of PlayStation 5 Pro revealed that the new console may fix an alleged design flaw in the standard PlayStation 5. This issue could render the PS5 completely unusable. And that's even though consoles haven't really suffered widespread crashes. But Sony seems to be taking quiet measures. To prevent such problems Happening on PS5 Pro

Because the PS5's GPU can be overclocked to as high as 2.23GHz, Sony instead opted to use liquid metal and thermal paste on the console's chips to direct heat to the heatsink. The advantage of liquid metal is that it conducts heat much better than thermal paste. But there is a major drawback. If liquid metal leaks from the box It will cause the motherboard to short circuit immediately. and cause irreparable damage to the system. Back in early 2023, reports claimed that this issue could occur on PS5s that were held upright for extended periods of time. This caused great concern among owners.

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Fortunately, it was later clarified that the PS5's liquid metal interface was likely a problem that could only occur with second-hand consoles that had previously been disassembled for other repairs. The PS5 is new and not yet has opened, there is very little risk of this problem, but it appears that Sony continues to design the PS5 Pro's internals to reduce liquid metal leaks. YouTube channel How-FixIT recently published a disassembly comparison between the PS5 Pro and PS5 Slim, finding that the new console's heatsink block has ridges that are likely to help spread the liquid metal across the chip.

The heatsink's surface orientation is believed to reduce the risk of liquid metal pooling on the bottom of the chip. and has a negative effect on the PS5 Pro's cooling performance in comparison. The PS5 Slim's heatsink contact area is flat, effectively proving that Sony has addressed the liquid metal concerns with the PS5 Pro. What's interesting is that this isn't the only implied change that Sony has made to the PS5. Pro Ahead of the console's launch, it was discovered that Sony had included an easily accessible compartment for the PS5 Pro's CMOS battery, allowing owners to easily replace the component if the battery malfunctions.

So far, liquid metal leaks haven't been apparent to many PS5 owners, with many even arguing the possibility of such an issue. Regardless, the design tweaks on the PS5 Pro's heatsink show that Sony is constantly keeping an eye on possible causes of hardware failure and fixing them in time. Both the PS5 and Xbox Series Well designed And it seems unlikely that either system would face a scandal like the Xbox 360's Red Ring of Death.

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